SKU: 71209036118
Ships within 48 hours · Estimated delivery Sep 2 - Sep 7
welding and send tin integration efforts temperature can be set between 200-500 degrees from the thermostat can be quickly replaced and automatically welded tin
supports iPhone 6/6S/7/8/X/11/12/13/14/15/16/17 series and Android phones
1x Output line
Output a preheating pulse first
color correction and other functions
YCS M.Y CPU/Middle Layer Reballing Platform for iPhone X-17 Pro Max laser welding machine welding and send tin integrationYCS MR. YANG BGA Reballing Stencil with Platform Kit for iPhone X 17 Pro Max middle layer and A11 A19 Pro CPU soldering repair. The reballing soldering kit includes various stencils designed for replacing and resoldering different circuit boards. It safely and effectively resolders iPhone CPU or mid frame solder joints, helping to repair iPhone malfunctions caused by solder joint issues. The BGA reballing platform kit supports repairs of mid layer
