SKU: 18558215177
Ships within 48 hours · Estimated delivery Sep 6 - Sep 11
Gross Weight: 624G
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UNI-T Thermal Imager For Smart Phone UTI260M UTI256M 256x192 Pixel Thermographic Camera Thermal Camera PCB Circuit Failure Smartphone Test Tool
JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform JBC Gross Weight: 624GJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians
US$ 20.83
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